The company "ElHimMet" has the opportunity to offer the following types of processes of applying copper coatings in our production, as well as the sale of electrolytes and technological processes for their implementation in your production.
Copper Coating Fluid. Copper from this liquid is applied to the product without applying an electric current. On the surface of the non-conductive product, conditions are created to initiate an autocatalytic reaction, leading to the deposition of a copper layer. It is used for the application of primary or, less frequently, the main coating on plastics, as a primary electrically conductive sublayer for electroplating, and is also used in work with extremely complex-shaped products when the use of electroplating methods does not give the desired result. We have different compositions, each of which has unique properties. The choice of a particular composition depends on the task. The deposition rate of copper 1 – 5 microns / hour. The coating is pure copper. It is delivered in the form of 2 solutions which mix up before operation. Before using these fluids on plastics, correct preparation of the plastic surface is necessary – degreasing, pickling, neutralization, sensitization, activation, acceleration and then copper plating. Further, the copper is already electrochemically grown in the first layer of copper.
Galvanic processes of copper coating.
Copper plating alkaline. After preparation of the surface of metal products – degreasing and activation, it is used to apply the first layer of copper well adhered to the base of the product. For steels, composition No. 1 is recommended, for copper alloys and aluminum, composition No. 2. With the help of these electrolytes, the problems of applying thick and shiny coatings are not solved. Work with soluble copper anodes. Composition No. 2 in the case of its application for the application of a sublayer copper coating on aluminum requires that the aluminum surface be degreased, pickled, clarified, galvanized, and then electrolyte No. 2 can be applied. Further application of the remaining electroplating will follow.
Copper plating for initial overgrowth over the first conductive layer during metallization and electroforming. It makes it possible to strengthen the very first immersion coating with chemical copper, chemical nickel or chemical silver for the further application of brilliant coatings with copper and nickel. The electrolyte is non-aggressive, non-edible and does not corrode the majority of materials that are sensitive to aggressive electrolytes. The product is sealed in it and the further use of fast but aggressive electrolytes does not threaten to corrode the basis of the product.
Copper plating, It is used to build a thick copper coating, which is supposed to be subsequently used to improve the surface by mechanical methods – sanding and polishing. Applied to copper or nickel sublayers. Can be used for electroforming. At low currents has the maximum dissipation. (coating with copper from this electrolyte climbs into inaccessible to other electrolytes places of the product)
Brilliant copper-plating with micro alignment. Copper Finish. It is characterized by a very beautiful natural copper color. The thicker the layer, the stronger the gloss. Before application requires the application of pre-coatings of copper, nickel, etc. Work with copper anodes brand AMF and MF. The most effective way to achieve surface specularity. The application of brilliant nickel on top of such copper and then gold results in a truly specular, corrosion-resistant decorative coating of the highest quality gold.
High speed electrolyte for copper electroforming. Allows you to raise 4 times the rate of growth of electroforming. Requires the use of copper anodes brand AMF, MF and continuous filtration in the bath. It is used after the matting of the frosted, over a copper-tightened at least 3 microns thick surface.
Copper plating for tribogalvanic pencil. Before use, it requires degreasing and surface activation of the coated product. Copper, platinized titanium can be used as an anode. Successfully replaces copper-containing gel. The coating retains its natural copper color for a long time.
High-speed tribological galvanic copper plating for rehtovka and the subsequent removal of the damaged surfaces of details and units "on the place". It is used for forced pumping and cooling of the electrolyte with copper anodes. Perhaps the fastest electrolyte copper plating.
Electrolyte for the application of brass. The color of the coating, as well as the content of the components, depends on the current density and may vary according to your discretion. We have several brass electrolytes, thanks to which it is possible to carry out the deposition of copper and zinc alloys with any content of components.
Electrolyte for applying bronze. The color of the coating, as well as the content of the components, depends on the current density and may vary according to your discretion. We have several bronzing electrolytes, thanks to which it is possible to carry out the deposition of copper and tin alloys with any content of components.
Electrolytes for applying the remaining copper alloys – call or write!
Liquid for fine etching of copper before electroplating.
Fluids and electrolytes for surface treatment of copper and copper-coated products.
Electrolyte electrolyte for copper and copper alloy products. It allows you to degrease the surface of the product, and thereby ensures the proper adhesion of any applied coatings. The product is connected to (-), stainless steel or nickel serves as an anode.
Chemical polishing of copper and its alloys. It is used for gloss products. The product is degreased and immersed in liquid on
Electroimpolation of copper and copper alloys. Before use requires degreasing products. It is an ideal method for the preparation of products from copper and copper alloys for electroplating. Allows you to dramatically increase the adhesion of the applied coatings and minimize the transition resistance. The product is connected to (+), the cathode is any metallic platinum (except for light metals).
Electrolyte to protect copper coatings from tarnishing. A thin transparent film is applied to a copper or copper-coated cathode product, galvanically applied to protect the copper surface from darkening. Not visible to the eye, unlike varnishes.
Several compositions copper patination fluids with giving various shades to products from copper, or covered with copper.